ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,716, issued on April 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnect with two-dimensional free zer... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,716, issued on April 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Interconnect with two-dimensional free zer... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,717, issued on April 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of manufact... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,717, issued on April 14, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure and method of manufact... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,718, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Memory device and method of manufacturing the same" was ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,718, issued on April 14, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Memory device and method of manufacturing the same" was ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,719, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a through-via ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,719, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having a through-via ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,720, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Through mold interconnect drill feature" was invented by Robe... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,720, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Through mold interconnect drill feature" was invented by Robe... Read More